Three-Dimensional Etching of Silicon for the Fabrication of Low-Dimensional and Suspended Devices

Nanoscale, 2012, Accepted Manuscript
DOI: 10.1039/C2NR32981F, Communication

Sameer S Walavalkar, Andrew P. Homyk, M. David Henry, Axel Scherer
In order to expand the use of nanoscaled silicon structures we present a new etching method that allows us to shape silicon with sub-10 nm precision. This top-down, CMOS compatible...
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